Thermal conductive adhesive LOCTITE ABLESTIK 2030SC

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LOCTITE ABLESTIK 2030SC die attach adhesive has been formulated for use in high throughput die attach applications. This material is designed to minimize stress and resulting warpage between dissimilar surfaces. It can be used in a variety of package sizes.


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LOCTITE ABLESTIK 2030SC die attach adhesive has been formulated for use in high throughput die attach applications. This material is designed to minimize stress and resulting warpage between dissimilar surfaces. It can be used in a variety of package sizes.


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