Hysol® FP4402

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Hysol® FP4402 is a low stress, liquid epoxy encapsulant designed for advanced chip on board applications. High purity and low thermal expansion characteristics provide excellent resistance to moisture and thermal shock, and reduced warpage of substrates. It is suitable for protecting a wide range of bare semiconductor devices, including LSI chips such as static RAM’s, mask ROM’s and gate arrays. The unique combination of low stress and excellent resistance to moisture and process fluids also ...


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Hysol® FP4402 is a low stress, liquid epoxy encapsulant designed for advanced chip on board applications. High purity and low thermal expansion characteristics provide excellent resistance to moisture and thermal shock, and reduced warpage of substrates. It is suitable for protecting a wide range of bare semiconductor devices, including LSI chips such as static RAM’s, mask ROM’s and gate arrays. The unique combination of low stress and excellent resistance to moisture and process fluids also provides good performance for special potting applications such as automotive sensors.


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